Method and apparatus for liquid treatment of wafer shaped articles
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United States of America Patent
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Jul 28, 2015
Grant Date -
Apr 17, 2014
app pub date -
Oct 12, 2012
filing date -
Oct 12, 2012
priority date (Note) -
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Abstract
In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid.
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