LED array module and manufacturing method thereof
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United States of America Patent
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Jul 28, 2015
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app pub date -
Aug 25, 2011
filing date -
Nov 2, 2010
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Abstract
The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.
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