Method and apparatus for processing wafer-shaped articles
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 28, 2015
Grant Date -
Apr 25, 2013
app pub date -
Oct 25, 2011
filing date -
Oct 25, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a method and apparatus for treating a surface of an article, an improved rinse liquid prevents build-up of static charge while avoiding damages to certain types of exposed metal-containing surfaces. In one embodiment, a semiconductor wafer having structures including at least one of cobalt, nickel and platinum is rotated on a spin chuck, as a rinse liquid is dispensed onto a surface of the wafer. The rinse liquid is a dilute aqueous solution of a base of the formula
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully