Adhesive tape for manufacturing electronic components
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United States of America Patent
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Jul 28, 2015
Grant Date -
Dec 29, 2011
app pub date -
Mar 9, 2009
filing date -
Mar 3, 2009
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Abstract
There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
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