Apparatus for mounting electronic component
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United States of America Patent
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Jul 21, 2015
Grant Date -
Mar 15, 2012
app pub date -
Sep 6, 2011
filing date -
Sep 15, 2010
priority date (Note) -
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Abstract
An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.
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