Semiconductor device manufacturing method
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United States of America Patent
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Jul 21, 2015
Grant Date -
Jan 15, 2015
app pub date -
Jun 17, 2014
filing date -
Jul 11, 2013
priority date (Note) -
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Abstract
A recessed portion is formed around an outer edge of a device wafer at a peripheral edge portion of a first face of the device wafer. A recessed portion is formed around an outer edge of a support substrate, at a bonding face of the support substrate. The first face of the device wafer and the bonding face of the support substrate are bonded together by an adhesive. The device wafer is ground from a second face side, on the opposite side to the first face 11, as far as a depth position to reach a bottom face of the recessed portion.
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