Electronic substrate

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United States of America Patent

PATENT NO 9087820
APP PUB NO 20130181357A1
SERIAL NO

13787225

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Abstract

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An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED INTERCONNECT SYSTEMS LIMITEDFIRST FLOOR BLACKTHORN EXCHANGE BRACKEN ROAD SANDYFORD DUBLIN D18 P3Y9

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Nobuaki Suwa, JP 244 3287

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