Optoelectronic package and method of manufacturing the same
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United States of America Patent
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Jul 14, 2015
Grant Date -
Jul 3, 2014
app pub date -
Dec 27, 2013
filing date -
Dec 28, 2012
priority date (Note) -
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Abstract
An optoelectronic package includes an optoelectronic chip, a transparent protection layer and a plurality of pads. The optoelectronic chip has an upper surface and an active area defined on the upper surface. The transparent protection layer is connected to the optoelectronic chip and covers the upper surface. The transparent protection layer touches and is entirely attached to the active area. The pads are electrically connected to the optoelectronic chip.
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