Method and apparatus for mounting semiconductor chips
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United States of America Patent
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Jul 14, 2015
Grant Date -
Jan 10, 2013
app pub date -
Jul 2, 2012
filing date -
Jul 8, 2011
priority date (Note) -
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Abstract
A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.
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