System for encapsulation of semiconductor dies
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United States of America Patent
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Jul 14, 2015
Grant Date -
Nov 10, 2011
app pub date -
Nov 17, 2009
filing date -
Nov 17, 2008
priority date (Note) -
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Abstract
The present invention describes two systems (100, 300) for encapsulation of semiconductor dies. Both systems (100, 300) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips is located within the aperture (104, 304). The first system (100) involves dispensing encapsulant (103) directly into an aperture. The second system (300) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).
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