Method of grinding wafer stacks to provide uniform residual silicon thickness
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United States of America Patent
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Jul 14, 2015
Grant Date -
Apr 30, 2015
app pub date -
Oct 27, 2014
filing date -
Oct 25, 2013
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Abstract
A method of processing a device wafer in a wafer stack by chucking the wafer stack device side down and grinding the exposed side of the carrier wafer to parallel with the device wafer, and thereafter flipping the wafer stack and chucking the wafer stack carrier side down and grinding residual silicon from the device wafer.
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