Semiconductor device and a method of manufacturing same
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United States of America Patent
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Jul 7, 2015
Grant Date -
Nov 28, 2013
app pub date -
May 15, 2013
filing date -
May 28, 2012
priority date (Note) -
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Abstract
In a semiconductor device where a metal circuit layer is disposed over a main planar surface of an insulating substrate, a semiconductor chip is connected by way of a solder over the metal circuit layer, and a metal wiring is connected over the metal circuit layer, in which a solder flow prevention area comprising a linear oxide material is formed between the semiconductor chip and the ultrasonic metal bonding region over the metal circuit layer.
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