TSV backside reveal structure and exposing process
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United States of America Patent
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Jul 7, 2015
Grant Date -
Nov 6, 2014
app pub date -
Nov 4, 2013
filing date -
May 3, 2013
priority date (Note) -
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Abstract
A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column; performing a first and a second chemical mechanical polishing process on the grinded substrate back surface; then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 μm.
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