Light-emitting diode manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 30, 2015
Grant Date -
Jun 26, 2014
app pub date -
Sep 24, 2013
filing date -
Dec 21, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an LED chip on the substrate; combining the flexible material layer and the hard material layer together wherein the LED chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully