Lead frame support plate and window clamp for wire bonding machines
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United States of America Patent
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Jun 30, 2015
Grant Date -
Aug 7, 2014
app pub date -
Apr 7, 2014
filing date -
Jul 13, 2012
priority date (Note) -
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Abstract
A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
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