Packaging or mounting a component
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United States of America Patent
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Jun 30, 2015
Grant Date -
May 17, 2012
app pub date -
Jun 30, 2010
filing date -
Jul 22, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes forming a slot in a sheet through a conductive layer thereof, the slot having width in a first direction between first and second edges and length in a second, transverse direction between first and second ends, providing a non-conductive layer on the sheet, the non-conductive layer having at least one window including a first window with length greater than the slot length and width less than the slot width, the first window positioned with respect to the slot such that edges of the first window are inside the edges of the slot and ends of the first window are outside the ends of the slot, placing a component on the conductive layer within the first window so as to bridge the slot and cutting through the sheet and the non-conductive layer along first and second lines outside sides of the component and within the edges the slot.
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