Methods and apparatus for cleaning semiconductor wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 30, 2015
Grant Date -
Jun 10, 2010
app pub date -
Jul 5, 2007
filing date -
Jul 5, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully