Micromachined structures

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United States of America Patent

PATENT NO 9070699
APP PUB NO 20120107545A1
SERIAL NO

13343187

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Abstract

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A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.

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Patent Owner(s)

Patent OwnerAddress
PIXART IMAGING INC5F NO 5 INNOVATION ROAD I SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU COUNTY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Weileun Hsin-Chu, TW 32 245
Sun, Chih Ming Hsin-Chu, TW 4 26
Tsai, Ming Han Hsin-Chu, TW 4 23
Wang, Chuanwei Hsin-Chu, TW 7 70

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