Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers

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United States of America Patent

PATENT NO 9070632
APP PUB NO 20130273739A1
SERIAL NO

13878361

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Abstract

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An aqueous polishing composition comprising (A) abrasive particles and (B) an amphiphilic nonionic surfactant selected from the group consisting of water-soluble or water-dispersible surfactants having (b1) hydrophobic groups selected from the group consisting of branched alkyl groups having 10 to 18 carbon atoms; and (b2) hydrophilic groups selected from the group consisting of polyoxyalkylene groups comprising (b21) oxyethylene monomer units and (b22) substituted oxyalkylene monomer units wherein the substituents are selected from the group consisting of alkyl, cycloalkyl, or aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and alkyl-cycloalkyl-aryl groups, the said polyoxyalkylene group containing the monomer units (b21) and (b22) in random, alternating, gradient and/or blocklike distribution; a CMP process for substrates having patterned or unpatterned low-k or ultra-low-k dielectric layers making use of the said aqueous polishing composition; and the use of the said aqueous polishing composition for manufacturing electrical, mechanical and optical devices.

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Patent Owner(s)

Patent OwnerAddress
BASF SELUDWIGSHAFEN AM RHEIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Wei Lan William Taipei, TW 3 15
Li, Yuzhuo Mannheim, DE 62 602
Raman, Vijay Immanuel Mannheim, DE 15 93
Rittig, Frank Worms, DE 23 69

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