Workpiece breakage prevention method and apparatus
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United States of America Patent
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Jun 30, 2015
Grant Date -
Jul 21, 2011
app pub date -
May 15, 2009
filing date -
May 16, 2008
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Abstract
Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.
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