Method and apparatus for producing and measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system

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United States of America Patent

PATENT NO 9068952
APP PUB NO 20110051132A1
SERIAL NO

12584294

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Abstract

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A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR TECHNOLOGIES CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Zhongping Fremont, US 6 27
Petrenko, Aleksey Milpitas, US 7 31
Romanovsky, Anatoly Palo Alto, US 28 361
Whiteside, Bret Gilroy, US 16 104
Wolters, Christian Campbell, US 29 312

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