Composition for formation of cured epoxy resin, and cured products thereof
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United States of America Patent
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Jun 30, 2015
Grant Date -
Aug 2, 2012
app pub date -
Oct 15, 2010
filing date -
Oct 16, 2009
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Abstract
An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C):
- (A) an epoxy resin;(B) a clathrate compound of a carboxylic acid derivative represented by formula (I):R(COOH)n (I);and an imidazole compound represented by formula (II);and (C) a tetrakisphenol type compound represented by formula (III).
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