Method for improving plating on non-conductive substrates
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United States of America Patent
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Jun 30, 2015
Grant Date -
May 30, 2013
app pub date -
Jan 15, 2013
filing date -
Jan 26, 2010
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Abstract
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
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