Extrinsic gettering on semiconductor devices
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United States of America Patent
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Jun 23, 2015
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N/A
app pub date -
Aug 9, 2010
filing date -
Aug 9, 2010
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Abstract
A semiconductor wafer, die and semiconductor package formed therefrom are disclosed, where the inactive surface of the wafer has an extrinsic gettering pattern formed from a texturing process. In examples, the texturing process follows a polishing process that removes stress concentration point from the inactive surface of the wafer.
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