Sputtering target-backing plate assembly, and its production method
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United States of America Patent
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Jun 23, 2015
Grant Date -
Sep 13, 2012
app pub date -
Oct 4, 2010
filing date -
Nov 20, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A sputtering target-backing plate assembly obtained by bonding a target material of Mg to a backing plate of Cu—Cr alloy, wherein the target material and the backing plate are bonded via a layer of Ni or an alloy comprising Ni as a main component at the interface therebetween. An object of the present invention is to provide a sputtering target-backing plate assembly that is used when magnesium (Mg) is the sputtering target material, and to resolve problems inherent in magnesium (Mg) and problems related to the selection of a backing plate to be compatible with magnesium by improving the bonding strength between the target and the backing plate in order to improve the sputtering efficiency.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- H01J:ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- C21D:MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C22C:ALLOYS
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