Method for forming microelectrode-pair arrays on silicon substrate surface with hydrophobic silicon pillars
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United States of America Patent
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Jun 23, 2015
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May 1, 2014
app pub date -
Apr 2, 2011
filing date -
Apr 2, 2011
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Abstract
Provided is a method of forming large-area directionally aligned nanowires on a silicon wafer surface with hydrophobic silicon pillars so as to form microelectrode-pair arrays, which belongs to the field of electronic circuit. The method includes grafting fluoroalkylsilane on the surface of a silicon wafer with hydrophilic silicon pillar arrays; increasing the contact angle between the surface of the hydrophilic silicon pillar arrays and water from 10° to 150° above and obtaining the silicon wafer with hydrophobic silicon pillar arrays; driving water solution containing materials used for forming nanowires to flow across the surface with the hydrophobic silicon pillar arrays uniformly, so that directionally aligned nanowires are formed on the tops of each two adjacent silicon pillars in the hydrophobic silicon pillar arrays; each of the nanowires connects the two adjacent silicon pillars together so as to form a microelectrode-pair, and a plurality of microelectrode-pairs constitute the microelectrode-pair arrays.
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