Manufacturing methods of semiconductor substrate, package and device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 16, 2015
Grant Date -
May 15, 2014
app pub date -
Jan 21, 2014
filing date -
Nov 17, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A manufacturing method of semiconductor substrate includes following steps: providing a base layer; forming a plurality of traces on the base layer; forming a plurality of studs correspondingly on the traces; forming a molding material layer on the base layer to encapsulate the traces and studs; forming a concave portion on the molding material layer; and, removing the base layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully