Apparatus with a multi-layer coating and method of forming the same
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United States of America Patent
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Jun 9, 2015
Grant Date -
Oct 20, 2011
app pub date -
Aug 11, 2009
filing date -
Aug 18, 2008
priority date (Note) -
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Abstract
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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