Multi-layer circuit board with waveguide to microstrip transition structure
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United States of America Patent
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Jun 9, 2015
Grant Date -
Feb 26, 2015
app pub date -
Aug 26, 2013
filing date -
Aug 26, 2013
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Abstract
A multi-layer circuit board with a waveguide to microstrip transition structure includes a laminated structure having a plurality of dielectric layers, a top metal frame disposed over the laminated structure, a microstrip line disposed over the laminated structure, a bottom metal frame underlying the laminated structure, and a plurality of conductors electrically connecting the top metal frame and the bottom metal frame. The top metal frame defines a top cavity, the bottom metal frame defines a bottom cavity corresponding to the top cavity, and the microstrip line extends into the top cavity. The laminated structure includes an upper dielectric layer and at least one lower dielectric layer, wherein top cavity exposes a top surface of the upper dielectric layer, and the bottom cavity exposes a bottom surface of the at least one lower dielectric layer.
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