System and method of ion neutralization with multiple-zoned plasma flood gun

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United States of America Patent

PATENT NO 9053907
APP PUB NO 20130264498A1
SERIAL NO

13439124

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Abstract

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An apparatus comprises a plasma flood gun for neutralizing a positive charge buildup on a semiconductor wafer during a process of ion implantation using an ion beam. The plasma flood gun comprises more than two arc chambers, wherein each arc chamber is configured to generate and release electrons into the ion beam in a respective zone adjacent to the semiconductor wafer.

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Patent Owner(s)

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chun-Lin Jhubei, TW 54 184
Hwang, Chih-Hong New Taipei, TW 20 37
Ku, Wen-Yu Hsinchu, TW 20 146
Lin, Chin-Hsiang Hsin-Chu, TW 424 6439
Yang, Chi-Ming Hsinchu, TW 184 1930

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1448831101 - 1011 - 2021 - 3031 - 4061 - 7002.557.51012.51517.52022.52527.53032.53537.54042.54547.55052.5

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