System and method of ion neutralization with multiple-zoned plasma flood gun
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jun 9, 2015
Grant Date -
Oct 10, 2013
app pub date -
Apr 4, 2012
filing date -
Apr 4, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An apparatus comprises a plasma flood gun for neutralizing a positive charge buildup on a semiconductor wafer during a process of ion implantation using an ion beam. The plasma flood gun comprises more than two arc chambers, wherein each arc chamber is configured to generate and release electrons into the ion beam in a respective zone adjacent to the semiconductor wafer.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD | 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78 |
International Classification(s)

- 2012 Application Filing Year
- G21G Class
- 45 Applications Filed
- 35 Patents Issued To-Date
- 77.78 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chang, Chun-Lin | Jhubei, TW | 54 | 184 |
# of filed Patents : 54 Total Citations : 184 | |||
Hwang, Chih-Hong | New Taipei, TW | 20 | 37 |
# of filed Patents : 20 Total Citations : 37 | |||
Ku, Wen-Yu | Hsinchu, TW | 20 | 146 |
# of filed Patents : 20 Total Citations : 146 | |||
Lin, Chin-Hsiang | Hsin-Chu, TW | 424 | 6439 |
# of filed Patents : 424 Total Citations : 6439 | |||
Yang, Chi-Ming | Hsinchu, TW | 184 | 1930 |
# of filed Patents : 184 Total Citations : 1930 |
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Patent Citation Ranking
- 0 Citation Count
- G21G Class
- 0 % this patent is cited more than
- 10 Age
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 9, 2026 |
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