Semiconductor device with sealing resin
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United States of America Patent
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May 26, 2015
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app pub date -
Dec 11, 2012
filing date -
Aug 30, 2005
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Abstract
Various embodiments of the present invention include a semiconductor device, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.
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