BSI image sensor package with embedded absorber for even reception of different wavelengths
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United States of America Patent
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May 26, 2015
Grant Date -
Aug 9, 2012
app pub date -
May 19, 2011
filing date -
Feb 3, 2011
priority date (Note) -
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Abstract
A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.
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