Thermal-conduction element for improving the manufacture of a package for transporting and/or storing radioactive materials
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United States of America Patent
Stats
-
May 26, 2015
Grant Date -
Feb 6, 2014
app pub date -
Mar 30, 2012
filing date -
Apr 18, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to a thermal conduction element (20) for a package for transporting and/or storing radioactive materials, comprising:
- an internal part (30) intended to be in contact with a lateral body (14) of the package;an external part (34) intended to form a portion of an external envelope (24) of said package, holding radiological protection means (22);an intermediate part (32) arranged between the internal and external parts,the internal, external and intermediate parts being produced from copper and one of the alloys thereof.
First Claim
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International Classification(s)
- 2012 Application Filing Year
- G21F Class
- 120 Applications Filed
- 100 Patents Issued To-Date
- 83.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- G21F Class
- 0 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 26, 2026 |
