Method for detaching a semiconductor chip from a foil

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9039867
APP PUB NO 20130255889A1
SERIAL NO

13839586

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises:

    lifting of the plates to a height H1 above the surface of a cover plate;lowering of a first pair of plates with L-shaped supporting edge;optionally, lowering of a second pair of plates with L-shaped supporting edge;lifting of the plates that have not yet been lowered to a height H2>H1;staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered;optionally, lowering of the plates that have not yet been lowered to a height H3

    Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
BESI SWITZERLAND AGHINTERBERGSTRASSE 32A CHAM 6330

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barmettler, Ernst Emmenbrucke, CH 2 5
Hurschler, Fabian Lucerne, CH 3 4
Pulis, Brian Knonau, CH 3 4

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 26, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00