Non-uniform vacuum profile die attach tip
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United States of America Patent
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May 26, 2015
Grant Date -
Aug 30, 2012
app pub date -
Feb 28, 2011
filing date -
Feb 28, 2011
priority date (Note) -
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Abstract
A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.
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