Apparatus, system and method for use in mounting electronic elements
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United States of America Patent
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May 19, 2015
Grant Date -
Jun 3, 2010
app pub date -
Jan 28, 2010
filing date -
Mar 28, 2006
priority date (Note) -
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Abstract
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.
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