Hybrid combination of substrate and carrier mounted light emitting devices
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United States of America Patent
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May 19, 2015
Grant Date -
Jul 10, 2014
app pub date -
Jun 28, 2013
filing date -
Mar 25, 2010
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Abstract
A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon the type of LED elements used, some of the LED elements may be mounted on the carrier structure, rather than on the more expensive ceramic substrate. In like manner, other devices, such as sensors and control elements, may be mounted on the carrier structure as well. Because the carrier and substrate structures are formed independent of the encapsulation and other after-formation processes, these structures can be tested prior to encapsulation, thereby avoiding the cost of these processes being applied to inoperative structures.
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