Chemically amplified positive photoresist composition
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United States of America Patent
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May 19, 2015
Grant Date -
Dec 2, 2010
app pub date -
Jun 1, 2010
filing date -
Jun 1, 2009
priority date (Note) -
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Abstract
A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.
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