Manufacture method of metal plate substrate for computer-to-plate of inkjet printing

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United States of America Patent

PATENT NO 9034430
APP PUB NO 20120021129A1
SERIAL NO

13124658

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Abstract

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A method for preparing a metal substrate for inkjet CTP, comprising: treating a metal substrate by anodizing or non-anodizing (such as sandpaper burnishing, sand blasting, polishing, or brushing), and then applying a hydrophilic polymer paint on the surface of the metal substrate. Due to the existence of nano-size or micron-size oxide particles in the hydrophilic polymer paint, the metal substrate has high specific surface energy, while the metal substrate has a certain roughness, therefore the metal substrate has ink absorbency and good abrasive resistance. The metal substrate can reduce the spread of ink droplets and produces print image having better resolution and definition. The non-anodizing method can avoid environmental pollution which is caused by waste acid and waste alkali discharge of anodizing method.

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Patent Owner(s)

Patent OwnerAddress
INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES100190 NO 2 NORTH FIRST STREET HAIDIAN DISTRICT BEIJING ZHONGGUANCUN BEIJING CITY BEIJING CITY 100190

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Song, Yanlin Beijing, CN 27 35
Zhou, Haihua Beijing, CN 35 135

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