Method for producing metal laminated substrate for oxide superconducting wire, and oxide superconducting wire using the substrate

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United States of America Patent

PATENT NO 9034124
APP PUB NO 20120040840A1
SERIAL NO

13127928

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Abstract

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A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate T1 having a thickness of not more than 0.2 mm and a metal foil T2 made of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 μm is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150° C. and not more than 1000° C. and, thereafter, an epitaxial growth film T3 made of Ni or an Ni alloy having a thickness of not more than 10 μm is laminated to the metal foil.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA
TOYO KOHAN CO LTD2-18-1 HIGASHI-GOTANDA SHINAGAWA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaneko, Akira Kudamatsu, JP 77 1344
Kato, Takeshi Osaka, JP 272 4409
Konishi, Masaya Osaka, JP 43 231
Okayama, Hironao Kudamatsu, JP 24 91

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