Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same
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United States of America Patent
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May 12, 2015
Grant Date -
Oct 17, 2013
app pub date -
Apr 12, 2012
filing date -
Apr 12, 2012
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Abstract
A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
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