Bonding structure of diaphragm for microspeaker
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United States of America Patent
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May 12, 2015
Grant Date -
Oct 30, 2014
app pub date -
Sep 19, 2013
filing date -
Apr 25, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
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