Wood preservative compositions useful for treating copper-tolerant fungi
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United States of America Patent
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May 5, 2015
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Aug 15, 2013
app pub date -
Jun 21, 2011
filing date -
Jun 21, 2010
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Abstract
The present invention provides a method of protecting wood or other celiulosic material from decay by copper-tolerant fungi, and wood preservative formulations for use in the same. The wood preservative formulations comprise a biocidal metal compound, a 1,2,4-triazole and a didecyl quaternary ammonium cation. Didecyldimethyl quaternary ammonium compounds are particularly preferred.
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