Molded polymeric spacing devices

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United States of America Patent

PATENT NO 9021765
SERIAL NO

12684471

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Abstract

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Substrates such as sheet metal components may be kept spaced apart from each other using a molded polymeric spacing device. The spacing device has a main body with a thickness corresponding to the desired minimum spacing between the substrates and, extending from the main body or a base connected to said main body, an attachment member capable of being inserted into an opening in one of the substrates, but resistant to being easily withdrawn from such opening. Noise and vibration that might otherwise be generated or propagated by closely proximate substrates are reduced through the use of such molded polymeric spacing devices, which may be integrally fashioned from a rubber.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAAHENKELSTRASSE 67 DÜSSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Radlick,, III Michael J Sterling Heights, US 1 3
Weber, Lawrence R Lawson, US 1 3
Ziehm, Mark W Rochester Hills, US 7 26

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