Electronic modules
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United States of America Patent
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Apr 28, 2015
Issued Date -
N/A
app pub date -
Aug 2, 2013
filing date -
Aug 2, 2013
priority date (Note) -
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Abstract
A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity.
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