Lens-equipped optical semiconductor device and method for manufacturing the same
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United States of America Patent
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Apr 28, 2015
Grant Date -
Jan 30, 2014
app pub date -
Apr 25, 2012
filing date -
Apr 28, 2011
priority date (Note) -
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Abstract
A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.
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