Surface-mountable electronic device
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United States of America Patent
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Apr 28, 2015
Issued Date -
N/A
app pub date -
Jun 19, 2008
filing date -
Apr 24, 2008
priority date (Note) -
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Abstract
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion. The outline of this rectangular portion corresponds to a connection surface of the JEDEC Standard MO-236 or of any other standard according to which the respective connection surface should not extend directly up to a side edge of the lower device side. The at least one connection surface furthermore has an extension section which extends, starting from the rectangular portion, in the direction of a side edge of the lower side of the device.
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