Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards
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United States of America Patent
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Apr 28, 2015
Grant Date -
Dec 22, 2011
app pub date -
Jun 16, 2011
filing date -
Jun 17, 2010
priority date (Note) -
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Abstract
Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.
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