Mixed alloy solder paste
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United States of America Patent
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Apr 28, 2015
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app pub date -
May 3, 2010
filing date -
May 3, 2010
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Abstract
A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than about 250° C.
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