Device and method for removing tested semiconductor components
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United States of America Patent
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Apr 21, 2015
Grant Date -
Dec 19, 2013
app pub date -
Jun 10, 2013
filing date -
Jun 13, 2012
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Abstract
A device for removing tested semiconductor components from a clamping carrier having fixed stop elements and movable clamping elements, pre-tensioned by spring elements includes an actuation device arranged above the clamping carrier, which moves the clamping elements into an opening position enabling the clamping carrier to be discharged, and then moves the clamping elements into a rest position after discharge, an intermediate carrier, positioned under the clamping carrier during discharge, onto which the clamping carrier is emptied, a data memory in which data about each semiconductor component are stored, and a removal device, which removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories in accordance with the data stored in the data memory.
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